3D split laser marking machine

Product Details：

Features:

1. High-speed and high-precision machining capabilitie

The 3D galvanometer system offers industrial-grade dynamic

• performance: Maximum marking speed: 5000 mm/s
• Maximum positioning speed: 10000 mm/s
• Following error: ≤0.25 ms
• Repeatability: <2 μrad

Practical significance:

• Enables high-speed continuous engraving and deep engraving without layering or pauses
• Ensures edge consistency of complex graphics (reliefs, textures)
• Suitable for mass industrial production (non-experimental equipment)

2. True 3D dynamic focusing capability (distinguishing it from the essence of 2D)

3D galvanometer with integrated third-axis dynamic focusing:

  • Z-axis dynamic zoom range: ±30 mm

  • Deflection angle: ±15°

Capabilities:

  • Direct machining of curved surfaces without fixtures

  • Automatic focus compensation during deep carving (avoiding defocusing and burning)

  • Enables:

 3D relief carving (multi-layer depth control)
 Surface marking (spherical, inclined, stepped surfaces)
 Machining of workpieces with large height differences

3. Small spot size + large format (advantages of the optical system)

System Support:

• Working Size: 150×150 mm (Standard)
• Incident Light Spot: 7 mm (1064nm)

Combined with Dynamic Compensation:

• “Point-by-Point Tracking Dynamic Light Spot Compensation Algorithm”

Actual Results:

• Maintains detail even on large-format surfaces (non-traditional galvanometer edge distortion)
• Suitable for:

Fine engraving (logo/mold texture)

Large-area filling (molds, leather)

4. Software-level 3D processing capabilities (core advantage)

Provides a complete 3D machining pipeline:

• Supports importing STL/DXF 3D models
• Supports:

3D layered machining

Surface projection marking

2.5D/3D deep engraving

• Dynamic parameter capabilities:

Linear power control

Linear speed control

Up to 256 layered process parameters

• Practical significance:

Truly achieves integrated "design → machining"

Can directly process complex industrial models (molds/electrodes/textures)

5. The process freedom brought by MOPA lasers (20–300W)

Key advantages of the JPT MOPA series (industry consensus):

• Adjustable pulse width (ns-level adjustable range)
• Wide frequency range (tens of kHz to MHz level)
• High peak power (suitable for deep engraving)
• Controllable heat-affected zone

Compared to a standard Q switch:

• MOPA avoids:

Burning and blackening

Edge melting

Thermal deformation

Key selling points：

1.High Flexibility (Software + Hardware Integration)

• Supports:3D / 2.5D / Curved Surfaces / Flying Marking
• Expandable:Rotary Axis Automated Production Lines
• Supports IO and TCP/IP Control：Suitable for Automation Integration

2. Wide material adaptability (truly "universal equipment")

Supported materials for processing (official specifications):

• Metals (steel, aluminum, copper, etc.)
• Non-metals (wood, leather, plastic, rubber)
• Hard materials (ceramics, marble, jade)

Note: This is not a single-industry device, but a general-purpose processing platform.

3. Long-term stability (industrial-grade design)

• 8-hour continuous drift: <30 mrad
• Anti-interference design + sealed structure

Practical Significance:

• Applicable to:

Continuous factory production

Long-term deep engraving of molds

Not only suitable for 1064nm fiber lasers, but also supports multiple wavelength systems:

• 1064nm (fiber laser) → Deep metal engraving / mold processing
• 532nm (green laser) → Fine processing of highly reflective materials (copper, gold, silver)
• 355nm (ultraviolet laser) → Plastics / Glass / Precision micromachining

 Supported Parameters:

• Wavelength range: 1064nm / 532nm / 355nm
• Incident spot: 7mm / 7mm / 3mm (matching different light sources)
  Different light sources correspond to different 3D processing

capabilities:

• Fiber system: ±30mm dynamic zoom
• Green system: ±7mm dynamic zoom
• Ultraviolet system: ±15mm dynamic zoom

Significance:

• Fiber → Strong removal capability (deep engraving/molds)
• Ultraviolet → High-precision shallow layer control (microstructure)

• Green light → Stable processing of highly reflective materials

  Large format + small spot size

• Standard format: 150×150 mm (supports interchangeable field lenses)
• Optional formats: 100 / 150 / larger expansion range
• Beam expansion ratio: 1.4 / 3 (adapts to different precision requirements)

 Practical significance:

• Small format → High-precision engraving
• Large format → Large-area processing
• Flexible switching between systems

Wide range of application scenarios：

Development Trends

With the deepening of Industry 4.0 and intelligent manufacturing, 3D laser marking is rapidly developing towards higher precision, faster speed, wider coverage, and AI intelligent integration. Split-type + 3D dynamic focusing technology has become the market mainstream, helping companies seamlessly transition from small-batch personalized customization to large-scale automated production, significantly reducing labor costs and improving production efficiency and product added value. In the future, combined with machine vision and automated production lines, 3D split-type laser marking machines will play a core role in more high-precision manufacturing fields.

Our 3D split-type laser marking machine is not just a piece of equipment, but a strategic tool for improving manufacturing quality and enhancing brand competitiveness. Whether planar or three-dimensional, simple or complex, it can easily achieve perfect marking.

Want to know specific power parameters (20W-300W optional), watch real marking sample videos, or schedule a trial run?

Contact us now! Our professional team will provide you with customized solutions to help your production enter a new era of precision.

’